2 2 . . 0 0 x x 1 1 . . 8 8 x x 0 0 . . 8 8 m m m m f f u u l l l l c c o o l l o o r r f f a a s s t t f f l l a a s s h h i i n n g g r r g g b b s s m m d d ost10807c1c-c features outline dimension high luminous leds 2.0 x 1.8 x 0.8mm standard directivity flashing type superior weather-resistance uv resistant epoxy water clear type applications toys games audio other lighting notes: 1. all dimensions are in millimeters ; 2. tolerance is 0.15 mm unless otherwise noted. absolute maximum rating (ta=25 ) )) ) directivity item symbol value unit power supply voltage 5 v operating temperature topr -30 ~ +85 storage temperature tstg -40~ +100 lead soldering temperature tsol 260 /5sec - electrical -optical characteristics (ta=25 ) )) ) 0 0 item symbol condition min. typ. max. unit dc forward voltage vdd i f =20ma 3.3 3.8 5.0 v oscillator frequency* fled i f =20ma - 12 - s duty cycle duty i f =20ma - - - - d (red) i f =20ma 620 625 630 nm d (blue) i f =20ma 465 470 475 nm domi. wavelength* d (green) i f =20ma 520 525 530 nm iv(red) i f =20ma 100 150 - mcd iv(blue) i f =20ma 50 90 - mcd luminous intensity* iv(green) i f =20ma 300 500 - mcd 50% power angle 2 1/2 i f =20ma - 120 - deg * 1 tolerance of chromaticity coordinates is + 10% * 2 tolerance of luminous intensity is + 15% led & application technologies
2 2 . . 0 0 x x 1 1 . . 8 8 x x 0 0 . . 8 8 m m m m f f u u l l l l c c o o l l o o r r f f a a s s t t f f l l a a s s h h i i n n g g r r g g b b s s m m d d ost10807c1c-c recommended soldering temperature ? time profile (r eflow soldering) surface mounting condition in automatic mounting of the smd leds on printed ci rcuit boards, any bending, expanding and pulling forces or shock against the smd leds should be kept min. to prevent them from electrical failures and mechanical damages of the devices. soldering reflow -soldering of the smd leds should conform to the so ldering condition in the individual specifications. -smd leds are designed for reflow soldering. -in the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical fail ures and damages of the devices. -we cannot guarantee the leds after they have been assembled using the solder dipping method. led & application technologies
2 2 . . 0 0 x x 1 1 . . 8 8 x x 0 0 . . 8 8 m m m m f f u u l l l l c c o o l l o o r r f f a a s s t t f f l l a a s s h h i i n n g g r r g g b b s s m m d d ost10807c1c-c 3) manual soldering conditions. - lead solder max. 300 for max. 3sec, and only one time. - lead-free solder max. 350 for max. 3sec, and only one time. - there is possibility that the brightness of leds is decreased, which is influenced by heat or ambien t atmosphere during reflow. it is recommended to use the nitrogen reflow method. - after leds have been soldered, repair should not be done. as repair is unavoidable, a double-head soldering iron should be used. it should be confirm ed beforehand whether the characteristics of the leds will be damaged by repairing or not. - reflow soldering should not be done more than two times. led & application technologies
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